specification features ? low leakage < 1 a @ 5 volt ? breakdown voltage: 6.4 7.2 volt @ 5 ma ? low capacitance (40 pf typical) ? esd protection meeting 6100042 level 4 and 16 kv human body model mechanical characteristics ? void free, transfermolded, thermosetting plastic case ? corrosion resistant finish, easily solderable ? package designed for optimal automated board assembly ? small package size for high density applications maximum ratings (t a = 25 c unless otherwise noted) rating symbol value unit peak power dissipation @ 8 x 20 s (note 1) p pk 75 watts steady state power dissipation (note 2) p d 385 mw thermal resistance junction to ambient derate above 25 c r ja 328 3.0 c/w mw/ c maximum junction temperature t jmax 150 c operating junction and storage temperature range t j , t stg 55 to +150 c esd discharge mil std 883c method 30156 iec6100042, air discharge iec6100042, contact discharge v pp 16 16 8 kv lead solder temperature (10 seconds duration) t l 260 c 1. per waveform figure 1 2. mounted on fr5 board = 1.0 x 0.75 x 0.062 in. LESD6V8T1G ordering information leshan radio company, ltd. 1/3 ? we declare that the material of product compliance with rohs requirements. device marking shipping LESD6V8T1G 68 3000/tape & reel dual transil array for esd protection suppressor designed to protect components which are connected to data and transmission lines against esd. it clamps the voltage just above the logic level supply for positive transients, and to a diode drop below ground for negative transients. it can also work as bidirectionnal suppressor by connecting only pin1 and 2. the is a dual monolithic voltage LESD6V8T1G sc-89
vi curve i f v i i r i t v rwm v br v f electrical characteristics breakdown voltage v br @ 5 ma (volts) leakage current i rm @ v rwm = 5 v typical capacitance @ 0 v bias max v f @ i f = 10 ma max z z @ 5 ma max z zk @ 0.5 ma device min nom max ( a) (pf) (v) ( ) ( ) 6.4 6.8 7.2 1.0 40 1.25 30 300 figure 1. 8 20 s pulse waveform 100 90 80 70 60 50 40 30 20 10 0 020406080 t, time ( s) % of peak pulse current t p t r pulse width (t p ) is defined as that point where the peak current decay = 8 s peak value i rsm @ 8 s half value i rsm /2 @ 20 s figure 2. capacitance 45 40 35 30 50 25 15 20 10 01 3 5 bias voltage (volts) typical capacitance (pf) 4 2 1 mhz frequency figure 3. forward voltage figure 4. clamping voltage versus peak pulse current 0.6 0.7 0.8 0.9 v f , forward voltage (volts) 10 1 8 9 10 12 v c , clamping voltage (volts) i , peak pulse current (amps) pp 1.0 1.1 1.2 i , forward current (a) f 11 8 x 20 s per figure 1 0.0001 0.01 0.1 1 0.001 LESD6V8T1G LESD6V8T1G leshan radio company, ltd. 2/3
leshan radio company, ltd. 3/3 package dimensions LESD6V8T1G g m 0.08 (0.003) x d 3 pl j -x- -y- notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeters 3. maximum lead thickness includes lead finish thickness. minimum lead thickness is the minimum thickness of base material. 4. 463c-01 obsolete, new standard 463c-02. a b y 12 3 n 2 pl k c -t- seating plane dim a min nom min nom inches 1.50 1.60 1.70 0.059 millimeters b 0.75 0.85 0.95 0.030 c 0.60 0.70 0.80 0.024 d 0.23 0.28 0.33 0.009 g 0.50 bsc h 0.53 ref j 0.10 0.15 0.20 0.004 k 0.30 0.40 0.50 0.012 l 1.10 ref m ??? ??? 10 ??? n ??? ??? 10 ??? s 1.50 1.60 1.70 0.059 0.063 0.067 0.034 0.040 0.028 0.031 0.011 0.013 0.020 bsc 0.021 ref 0.006 0.008 0.016 0.020 0.043 ref ??? 10 ??? 10 0.063 0.067 max max m h h l g recommended pattern of solder pads s sc - 8 9
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